Laser joining method

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United States of America Patent

PATENT NO 9421712
APP PUB NO 20140332157A1
SERIAL NO

14363174

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Abstract

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The present invention provides a method for stably and robustly laser-welding transparent resins together without compromising transparency. Before laser welding, the joining surface of at least a second transparent resin is subjected to photooxidation, thereby reducing the laser transmittance without reducing the visible light transmittance. A laser beam in the ultraviolet region at a wavelength of 400 nm or less, or a laser beam with a pulse width of 10 ps or less is irradiated while the second transparent resin is pressurized to perform laser welding.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Satoshi Tokyo, JP 235 3219
Senda, Takeshi Tokyo, JP 21 76

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