Heat transfer device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9423185
APP PUB NO 20120175083A1
SERIAL NO

13497189

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Abstract

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A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION3-1-1 KYOBASHI CHUO-KU TOKYO 104-0031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanada, Masato Minato-ku, JP 15 57
Yamada, Yoshihito Minato-ku, JP 44 142
Yamakage, Hisaaki Minato-ku, JP 14 130

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