Probe card for testing wafers

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United States of America Patent

PATENT NO 9423423
SERIAL NO

14010083

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Abstract

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A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.

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Patent Owner(s)

Patent OwnerAddress
HERMES-EPITEK CORP14F NO 38 SEC 2 DUNHUA S RD DA-AN DIST TAIPEI CITY 106

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Chien-Yao Hsin-Chu, TW 8 23

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