Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods

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United States of America Patent

PATENT NO 9425175
APP PUB NO 20160141279A1
SERIAL NO

15002333

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Abstract

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Embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies and methods of making them are provided. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITEDSINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Krabe, Detlef Bernd Munich, DE 4 19
Wittl, Josef Parsberg, DE 20 147

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