RDL-first packaging process

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United States of America Patent

PATENT NO 9425178
APP PUB NO 20160013172A1
SERIAL NO

14325842

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Abstract

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A method includes forming a first plurality of Redistribution Lines (RDLs) over a carrier, and bonding a device die to the first plurality of RDLs through flip-chip bonding. The device die and the first plurality of RDLs are over the carrier. The device die is molded in a molding material. After the molding, the carrier is detached from the first plurality of RDLs. The method further includes forming solder balls to electrically couple to the first plurality of RDLs, wherein the solder balls and the device die are on opposite sides of the first plurality of RDLs.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Chen, Shing-Chao Zhubei, TW 22 119
Cheng, Ming-Da Jhubei, TW 447 4774
Lin, Chih-Wei Zhubei, TW 359 5145
Liu, Chung-Shi Hsin-Chu, TW 824 11367

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