Socket package including integrataed capacitors

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9426918
APP PUB NO 20100197151A1
SERIAL NO

12366208

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Importance

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Abstract

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A socket package is provided to be positioned between a circuit package and a printed circuit board (PCB). The socket package includes a plurality of interconnects, to connect portions of the circuit package to portions of the PCB. Additionally, a plurality of capacitors are included with the socket package. The capacitors connect the interconnects provided to the socket package, and may be provided in lieu of capacitors in a circuit package, thus decreasing the complexity and build cost of the circuit package.

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First Claim

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Patent Owner(s)

  • ORACLE AMERICA, INC.;SUN MICROSYSTEMS, INC.;AMI ATTACHMENTS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bet-Shliemoun, Ashur S San Jose, US 6 108

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