Shielded encapsulating structure and manufacturing method thereof
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United States of America Patent
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Aug 30, 2016
Grant Date -
Aug 6, 2015
app pub date -
Apr 14, 2015
filing date -
Oct 27, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.
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