Pattern forming method, composition used therein, method for manufacturing electronic device, and electronic device
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United States of America Patent
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Aug 30, 2016
Grant Date -
Apr 30, 2015
app pub date -
Dec 12, 2014
filing date -
Jun 12, 2012
priority date (Note) -
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Abstract
A pattern forming method includes: (i) a step of forming a first film by using an actinic ray-sensitive or radiation-sensitive resin composition (I), (ii) a step of exposing the first film, (iii) a step of developing the exposed first film by using an organic solvent-containing developer to form a negative pattern, (iv) a step of forming a second film on the negative pattern by using a specific composition (II), (v) a step of increasing polarity of the specific compound present in the second film, and (vi) a step of removing a specific area of the second film by using the organic solvent-containing remover.
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