Scaling voltages in relation to die location

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United States of America Patent

PATENT NO 9430603
SERIAL NO

14959346

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The method includes identifying, by one or more computer processors, a location that corresponds to an integrated circuit chip on a wafer. The method further includes identifying, by one or more computer processors, an on-chip variation of the integrated circuit chip. The method further includes determining, by one or more computer processes, a desired voltage for the integrated circuit chip based upon the identified on-chip variation of the integrated circuit chip. The method further includes adjusting, by one or more computer processors, the voltage of the integrated circuit chip via a voltage regulated on the integrated circuit chip based upon the determined desired voltage.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Foreman, Eric A Fairfax, US 85 747
Habib, Nazmul Colchester, US 65 438
Kalafala, Kerim Rhinebeck, US 87 557

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