Wire bonded IC components to round wire

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United States of America Patent

PATENT NO 9431363
SERIAL NO

14553519

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Importance

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Abstract

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A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.

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Patent Owner(s)

Patent OwnerAddress
AUTOMATED ASSEMBLY CORPORATION20777 KENSINGTON BOULEVARD LAKEVILLE MN 55044

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lindblad, Scott Lakeville, US 23 69
Neuman, David Randolph, US 33 166
Neuman, Robert Cannon Falls, US 18 147

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