Method for making a semiconductor device with sidewall spacers for confining epitaxial growth

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United States of America Patent

PATENT NO 9431540
SERIAL NO

14288766

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Abstract

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A method for making a semiconductor device includes forming laterally spaced-apart semiconductor fins above a substrate. At least one dielectric layer is formed adjacent an end portion of the semiconductor fins and within the space between adjacent semiconductor fins. A pair of sidewall spacers is formed adjacent outermost semiconductor fins at the end portion of the semiconductor fins. The at least one dielectric layer and end portion of the semiconductor fins between the pair of sidewall spacers are removed. Source/drain regions are formed between the pair of sidewall spacers.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Xiuyu Niskayuna, US 195 3738
Liu, Qing Watervliet, US 478 5038
Xie, Ruilong Schenectady, US 1408 10685
Yeh, Chun-chen Clifton Park, US 417 3455

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