Packaging method and system for LEDs
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United States of America Patent
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Aug 30, 2016
Grant Date -
Jul 11, 2013
app pub date -
May 10, 2012
filing date -
Jan 6, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A slim LED package configured to handle large current, having a narrow width, an LED chip mounting area positioned centro-symmetrically within the package, mounting holes positioned equidistantly from the mounting area, wherein multiple packages may be arranged with alternating anode and cathode ends in such a manner that a high-power density radiometric flux line may be created. Some embodiments include current density management areas positioned on one more sides of the LED chip mounting area.
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