Textured encapsulant surface in LED packages
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United States of America Patent
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Aug 30, 2016
Grant Date -
Jun 18, 2009
app pub date -
Dec 14, 2007
filing date -
Dec 14, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
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