Method of coupling a feedthrough assembly for an implantable medical device

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United States of America Patent

PATENT NO 9431801
SERIAL NO

13902287

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Abstract

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One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case.

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Patent Owner(s)

Patent OwnerAddress
HERAEUS DEUTSCHLAND GMBH & CO KGHERAEUSSTRASSE 12-14 HANAU 63450

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hausch, Ulrich Frankfurt, DE 32 107
Markham, Jacob Vadnais Heights, US 17 109
Pavlovic, Goran Schaafheim, DE 21 474

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