Bonding wire and method for manufacturing same
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United States of America Patent
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Sep 6, 2016
Grant Date -
Nov 6, 2014
app pub date -
Jul 18, 2014
filing date -
Jan 25, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.
First Claim
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- B21C:MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PR....
- C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
- B22D:CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY ....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C22C:ALLOYS
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