Apparatus and method for power cycle test

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United States of America Patent

PATENT NO 9435850
APP PUB NO 20140021974A1
SERIAL NO

13945757

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Abstract

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Provided are a power cycle test apparatus and a power cycle test method that can efficiently reproduce nearly a level of stress that may occur in failure mode in actual environments, the apparatus which is a test apparatus for performing a power cycle test for a power semiconductor device to be tested by applying a thermal stress to the power semiconductor device through the application of a stress current thereto in predefined ON/OFF cycles executes a thermal cycle test in temperature rise-fall cycles longer than the ON/OFF cycles by using an apparatus configured to change an external environmental temperature and further executes the power cycle test while executing the thermal cycle test in synchronization with execution phases of the thermal cycle test.

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Patent Owner(s)

Patent OwnerAddress
ESPEC CORPOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Suyama, Katsumasa Osaka, JP 2 8

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