Interconnect for transmitting signals between a device and a tester

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9435855
APP PUB NO 20150137848A1
SERIAL NO

14084414

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material.

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Patent Owner(s)

  • TERADYNE, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DiPalo, Craig Anthony Acton, US 1 20
Lewinnek, David Walter Somerville, US 5 54
Sinsheimer, Roger Allen Camarillo, US 7 96
Valiente, Luis Antonio Dracut, US 2 30

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