Method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame
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United States of America Patent
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Sep 6, 2016
Grant Date -
Dec 24, 2015
app pub date -
Aug 31, 2015
filing date -
Mar 18, 2013
priority date (Note) -
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Abstract
A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.
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