Hot rolled plate made of copper alloy used for a sputtering target and sputtering target

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United States of America Patent

PATENT NO 9437405
APP PUB NO 20150318153A1
SERIAL NO

14654210

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Abstract

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Disclosed is a hot rolled plate produced by hot rolling an ingot cast by continuous casting, in which the plate is made of a copper alloy containing 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities and the average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATIONTOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koide, Masato Kagawa-gun, JP 7 74
Okubo, Kiyoyuki Tokyo, JP 1 0

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