Method for manufacturing ceramic substrate

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United States of America Patent

PATENT NO 9437549
SERIAL NO

14808656

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Abstract

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A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

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Patent Owner(s)

Patent OwnerAddress
VIKING TECH CORPORATIONNO 70 GUANGFU N RD HUKOU TOWNSHIP HSINCHU COUNTY 303

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Chien-Hung Hsinchu County, TW 31 254
Kuo, Chen-Shen Hsinchu County, TW 4 5
Wu, Chun-Chu Hsinchu County, TW 2 22

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