Mounting structure of chip component and electronic module using the same
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United States of America Patent
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Sep 6, 2016
Grant Date -
Jun 5, 2014
app pub date -
Nov 26, 2013
filing date -
Nov 30, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.
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