Passive component as thermal capacitance and heat sink

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United States of America Patent

PATENT NO 9443798
APP PUB NO 20140110820A1
SERIAL NO

13654447

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AUSTRIA AG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Paolucci, Milko Villach, AT 6 76
Standing, Martin Villach, AT 93 804

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