Passive component as thermal capacitance and heat sink

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9443798
APP PUB NO 20140110820A1
SERIAL NO

13654447

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Representative implementations of devices and techniques provide improved thermal performance of a chip die disposed within a layered printed circuit board (PCB). Passive components may be strategically located on one or more surfaces of the PCB. The passive components may be arranged to conduct heat generated by the chip die away from the chip die.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • INFINEON TECHNOLOGIES AUSTRIA AG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Paolucci, Milko Villach, AT 6 99
Standing, Martin Villach, AT 96 955

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Mar 13, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 13, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00