Bonding head
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United States of America Patent
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Sep 20, 2016
Issued Date -
N/A
app pub date -
Jun 3, 2013
filing date -
Jun 28, 2012
priority date (Note) -
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Abstract
A bonding head 6 is provided with a tool base 8 in a housing 6A and a laser for transmitting laser beam L is configured such that the laser beam L transmitted through this tool base 8 can heat an electronic component 3 and bond the same to a substrate 2. A surface of a heat-radiating member 15 is provided in contact with a surface of the tool base 8 on which the laser beam L impinges. This heat-radiating member 15 has a light transmittance for transmitting the laser beam L and also has a thermal conductivity higher than the thermal conductivity of the tool base 8. The tool base 8 is heated during bonding treatment, but heat transmitted to the tool base 8 rapidly escapes to the heat-radiating member 15 having a higher thermal conductivity.
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