Epitaxial growth techniques for reducing nanowire dimension and pitch
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United States of America Patent
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Sep 20, 2016
Grant Date -
Jun 23, 2016
app pub date -
Dec 22, 2014
filing date -
Dec 22, 2014
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Abstract
Techniques for reducing nanowire dimension and pitch are provided. In one aspect, a pitch multiplication method for nanowires includes the steps of: providing an SOI wafer having an SOI layer separated from a substrate by a BOX, wherein the SOI layer includes Si; patterning at least one nanowire in the SOI layer, wherein the at least one nanowire as-patterned has a square cross-sectional shape with flat sides; growing epitaxial SiGe on the outside of the at least one nanowire using an epitaxial process selective for growth of the epitaxial SiGe on the flat sides of the at least one nanowire; removing the at least one nanowire selective to the epitaxial SiGe, wherein the epitaxial SiGe that remains includes multiple epitaxial SiGe wires having been formed in place of the at least one nanowire that has been removed.
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