Cableless connection apparatus and method for communication between chassis
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United States of America Patent
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Sep 20, 2016
Issued Date -
N/A
app pub date -
Apr 3, 2014
filing date -
Apr 3, 2014
priority date (Note) -
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Abstract
Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
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