Devices and methods for analyzing layers of samples
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United States of America Patent
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Sep 27, 2016
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app pub date -
Jul 21, 2015
filing date -
Jan 26, 2015
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Abstract
The present disclosure generally relates to systems, devices and methods for analyzing and processing samples or analytes. In one example configuration, a method of analyzing an analyte includes shaving a first layer of a plurality of layers of an analyte to expose a first surface of an analyte. The method includes positioning the first surface of the analyte over a window of a hyperspectral analyzation subassembly. The method further includes scanning the first surface of the analyte by the hyperspectral analyzation subassembly to obtain information regarding the analyte proximate the first surface. Other systems, devices and methods are disclosed herein.
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