Apparatus and method for power cycle test
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United States of America Patent
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Sep 27, 2016
Grant Date -
Jan 23, 2014
app pub date -
Jul 17, 2013
filing date -
Jul 18, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a power cycle test apparatus that eliminates the need to measure a thermal resistance in a power cycle test and that pursues power saving in the evaluation of IGBT reliability by exactly applying a required thermal stress through the automatic adjustment of a stress current. The power cycle test apparatus performs a power cycle test for an IGBT to be tested by applying a thermal stress to the IGBT to be tested through the intermittent application of a stress current thereto. The apparatus applies the stress current to the IGBT to be tested and thereafter applies a current for measurement to the IGBT to be tested to measure a collector-emitter voltage of the IGBT to be tested. The apparatus further obtains a junction temperature of the IGBT to be tested from the measured collector-emitter voltage and a temperature coefficient of the IGBT to be tested.
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