Low dielectric materials

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United States of America Patent

PATENT NO 9455067
APP PUB NO 20160148719A1
SERIAL NO

14982957

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 1000˜7000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl group having a Mw of 1000˜5000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8, wherein the dielectric material has Dk of 3.4-4.0 and Df of 0.0025-0.0050. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

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Patent Owner(s)

Patent OwnerAddress
ITEQ CORPORATIONNO 17 DALUGE RD XINPU TOWNSHIP HSINCHU COUNTY 30544

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Li-Chun Hsinchu County, TW 27 250
Yin, Meng-Song Hsinchu County, TW 16 48

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