Integrated inductor device with high inductance in a radiofrequency identification system
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United States of America Patent
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Oct 4, 2016
Grant Date -
Oct 4, 2012
app pub date -
Apr 2, 2012
filing date -
Apr 1, 2011
priority date (Note) -
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Abstract
An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level.
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