Parallel signal via structure

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United States of America Patent

PATENT NO 9461000
APP PUB NO 20140346678A1
SERIAL NO

14283113

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Abstract

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A silicon interposer with redundant thru-silicon vias. The silicon interposer includes a first trace structure on a first side of the interposer and a second trace structure on a second side of the interposer. The silicon interposer also includes at least two redundant thru-silicon vias connecting the first trace structure to the second trace structure.

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Patent Owner(s)

  • ESILICON CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeLaCruz, Javier Summit, US 29 779

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