Composition and methods of forming solder bump and flip chip using the same

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United States of America Patent

PATENT NO 9462736
SERIAL NO

14325482

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Abstract

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Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

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Patent Owner(s)

Patent OwnerAddress
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE218 GAJEONG-RO YUSEONG-GU DAEJEON 34129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eom, Yong Sung Daejeon, KR 48 160
Jang, Keonsoo Suwon-si, KR 8 11
Moon, Jong Tae Gyeryong-si, KR 38 286
Oh, Sangwon Daejeon, KR 5 9

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