Method of manufacturing liquid ejection head and liquid ejection head
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United States of America Patent
Stats
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Oct 11, 2016
Grant Date -
Jun 12, 2014
app pub date -
Dec 5, 2013
filing date -
Dec 6, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a liquid ejection head including a liquid ejection substrate, an electric wiring member, and a supporting member having a first supporting surface and a second supporting surface, including: positioning an outer peripheral portion of the electric wiring member disposed on the side of the second supporting surface outside of the second supporting surface; providing the supporting member with the first depression at a position facing one part of the outer peripheral portion of the electric wiring member and the second depression connected to the first depression at a position facing another part of the outer peripheral portion having a width smaller than that of the first depression, and applying an adhesive agent in the first depression to cause part of the adhesive agent to flow into the second depression, so that the outer peripheral portion of the electric wiring member is adhered to the supporting member.
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