Integrated electronic device for monitoring mechanical stress within a solid structure
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United States of America Patent
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Oct 11, 2016
Grant Date -
Jul 3, 2014
app pub date -
Dec 17, 2013
filing date -
Dec 27, 2012
priority date (Note) -
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Abstract
The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.
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