Test method for semiconductor device having stacked plural semiconductor chips
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United States of America Patent
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Oct 11, 2016
Grant Date -
Jan 23, 2014
app pub date -
Jul 16, 2013
filing date -
Jul 20, 2012
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Abstract
Disclosed herein is a method for testing a semiconductor device, the method includes: preparing a first semiconductor chip having a first bump electrode and a first driver circuit that drives the first bump electrode, and a second semiconductor chip having a second bump electrode and a second driver circuit that drives the second bump electrode; staking the first and second semiconductor chips so that the first bump electrode and the second bump electrode are electrically connected to each other to form a current path including the first and second bump electrodes; and driving, in a test mode, the current path to a first potential by the first driver circuit while driving the current path to a second potential different from the first potential by the second driver circuit.
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