Methods of fabricating features associated with semiconductor substrates

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United States of America Patent

PATENT NO 9466504
APP PUB NO 20160293433A1
SERIAL NO

14674127

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Abstract

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Some embodiments include a method of fabricating features associated with a semiconductor substrate. A first region of the semiconductor substrate is altered relative to a second region. The altered first region has different physisorption characteristics for polynucleotide relative to the second region. The altered first region and the second region are exposed to polynucleotide. The polynucleotide selectively adheres to either the altered first region or the second region to form a polynucleotide mask. The polynucleotide mask is used during fabrication of features associated with the semiconductor substrate.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sandhu, Gurtej S Boise, US 1217 32434
Sills, Scott E Boise, US 205 1182

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