Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method

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United States of America Patent

PATENT NO 9466508
APP PUB NO 20150380273A1
SERIAL NO

14763891

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a liquid composition used for etching a multilayer film containing copper and molybdenum, an etching method for etching a multilayer film containing copper and molybdenum, and a substrate. The present invention further provides a liquid composition for etching a multilayer-film wiring substrate which has an oxide layer (IGZO) including indium, gallium and zinc laminated on the substrate, and further a multilayer film including at least a layer containing molybdenum and a layer containing copper provided thereon, a method for etching a multilayer film containing copper and molybdenum from the substrate, and a substrate. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source, and (C) at least one type of amine compound selected from the group consisting of 1-amino-2-propanol, 2-(methylamino)ethanol, 2-(ethylamino)ethanol, 2-(butylamino)ethanol, 2-(dimethylamino)ethanol, 2-(diethylamino)ethanol, 2-methoxyethylamine, 3-methoxypropylamine, 3-amino-1-propanol, 2-amino-2-methyl-1-propanol, 1-dimethylamino-2-propanol, 2-(2-aminoethoxyl)ethanol, morpholine and 4-(2-hydroxyethyl)morpholine and having a pH value of 4-9 is used.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INC5-2 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 1008324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tamai, Satoshi Tokyo, JP 42 234
Yube, Kunio Tokyo, JP 10 35

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