Systems and methods for drying high aspect ratio structures without collapse using stimuli-responsive sacrificial bracing material
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United States of America Patent
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Oct 11, 2016
Grant Date -
Mar 24, 2016
app pub date -
Sep 18, 2014
filing date -
Sep 18, 2014
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Abstract
Systems and methods for drying a substrate including a plurality of high aspect ratio (HAR) structures is performed after at least one of wet etching and/or wet cleaning the substrate using at least one of wet etching fluid and/or wet cleaning fluid, respectively, and without drying the substrate. Fluid between the plurality of HAR structures is displaced using a solvent including a bracing material. After the solvent evaporates, the bracing material precipitates out of solution and at least partially fills the plurality of HAR structures. The plurality of HAR structures are exposed to non-plasma based stimuli to remove the bracing material.
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