Bonding system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9468106
APP PUB NO 20140259648A1
SERIAL NO

14161958

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A bonding system 1 includes a plurality of laser resonators 7 and a plurality of optical fibers f1 to f36 each having a laser beam inlet connected to one of the plurality of laser resonators. The optical fibers are bundled, and laser beam outlets of the optical fibers are disposed so as to optically face a heating region S of an electronic component 3, and the heating region is irradiated with spots of laser beams emitted from the laser beam outlets. The heating region S is divided into at least corner sub-regions S1 at the corners of the electronic component and an inner sub-region S2 inside the electronic component, and the laser power of the laser resonators whose laser beam outlets face the corner sub-regions is set higher than the laser power of the laser resonators whose laser beam outlets face the inner sub-region.

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Patent Owner(s)

Patent OwnerAddress
SHIBUYA KOGYO CO LTDKANAZAWA-SHI ISHIKAWA 920-8681

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Eiji Kanazawa, JP 90 870

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