Components with multi-layered cooling features and methods of manufacture
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United States of America Patent
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Oct 25, 2016
Grant Date -
May 28, 2015
app pub date -
Nov 26, 2013
filing date -
Nov 26, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacturing method includes providing a substrate having one or more grooves formed therein. One or more coatings having one or more grooves formed therein are disposed on the substrate and in fluid communication with the one or more grooves in the substrate. A cover coating is disposed on a portion of an outermost surface of the one or more coatings, having one or more cooling outlets formed therein and in fluid communication with the one or more grooves in the one or more coatings. The substrate, the one or more coatings and the cover coating define therein a cooling network for cooling a component. A component having a cooling network defined therein a substrate, one or more coatings disposed on at least a portion of the substrate, and a cover coating disposed over at least a portion of an outermost coating of the one or more coatings.
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