Copper alloy wire and copper alloy spring
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United States of America Patent
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Oct 25, 2016
Grant Date -
Jan 9, 2014
app pub date -
Dec 13, 2011
filing date -
Dec 13, 2010
priority date (Note) -
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Abstract
A copper alloy wire is a filamentary material of a copper alloy containing, in percent by mass, Ni: 3.0 to 15.0%, Al: 0.5 to 5.0%, and Si: 0.1 to 3.0%, with the remainder being composed of Cu and incidental impurities, which is provided with the tensile strength (σB) of 900 to 1300 MPa and electrical conductivity of 10 to 22% IACS and, in addition to that property, satisfies an intensity ratio of A:B:C of 1.0:1.2 to 6.0:2.2 to 8.0 when A, B and C represent diffraction intensities of Cu (111), Cu (200) and Cu (220), respectively, according to an X-ray diffraction method in a predetermined cross section, and which is used for an operation or contact spring by incorporating in mobile phones and various small electronic instruments by formulating into a copper alloy spring used, particularly, for an electrical conductive spring.
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