Resin-sealed semiconductor device
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United States of America Patent
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Nov 1, 2016
Grant Date -
Jul 23, 2009
app pub date -
Oct 23, 2008
filing date -
Oct 25, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
There is provided a resin-sealed semiconductor device (BGA type semiconductor device) whose heat dissipating characteristic is improved, so that it is prevented from deteriorating in reliability. This BGA type semiconductor device includes a wiring substrate on a predetermined area on which a semiconductor chip is mounted; a plurality of metal bumps that are formed to be arranged at predetermined intervals in an area of the substrate different from the area on which the semiconductor chip is mounted; and a sealing resin layer that covers at least the semiconductor chip. Each of the plurality of metal bumps is covered with the sealing resin layer described above, with a part thereof exposed at a top face of the sealing resin layer.
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