Word line hook up with protected air gap

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9484314
APP PUB NO 20160064345A1
SERIAL NO

14836730

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Abstract

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A method of forming a semiconductor device includes forming a plurality of word lines separated by air gaps with contact pad structures connected to the word lines, and forming a dummy structure directly opposite an air gap between neighboring word lines. Subsequently, the contact pad structures are cut into individual contact pads by a contact pad cut that intersects the dummy structure.

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Patent Owner(s)

  • SANDISK TECHNOLOGIES LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukai, Masayuki Yokkaichi, JP 34 582
Shimoda, Atsushi Yokkaichi, JP 36 384
Takahashi, Yuji Yokkaichi, JP 365 5667

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