Diamond wire saw
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United States of America Patent
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Nov 8, 2016
Grant Date -
Jul 30, 2015
app pub date -
Jun 27, 2013
filing date -
Jul 27, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a wire saw intended for cutting concrete, stone or the like, more particularly, a diamond wire saw which is configured such that each front of beads is formed to be curved so that the beads can appropriately respond to resistance transmitted from an object to be cut without being in direct contact with the resistance, cutting diamond layers are electrodeposited and attached to the curved portions, and a large quantity of cutting chips are accommodate and are then discharged to the outside so that the number of installed beads can be easily adjusted.
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