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United States of America Patent

PATENT NO 9490198
SERIAL NO

14958927

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Importance

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Abstract

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Provided is a transmitter and receiver package including an interposer substrate including a top surface, a bottom surface facing the top surface, and a through-via, semiconductor devices mounted on the top surface of the interposer substrate, an exothermic element mounted on the bottom surface of the interposer substrate, and a heat dissipation member disposed on the bottom surface of the interposer substrate, the heat dissipation member being configured to cover the exothermic element.

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Patent Owner(s)

  • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eom, Yong Sung Daejeon, KR 48 160

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