Anisotropic conductive film including conductive adhesive layer and semiconductor device connected by the same

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United States of America Patent

PATENT NO 9490228
APP PUB NO 20140291869A1
SERIAL NO

14229003

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Abstract

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An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

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Patent Owner(s)

Patent OwnerAddress
CHEIL INDUSTRIES INCGUMI-SI GYEONGSANGBUK-DO 730-030

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Jae Sun Uiwang-si, KR 24 95
Hwang, Ja Young Uiwang-si, KR 9 31
Kim, Ji Yeon Uiwang-si, KR 146 611
Kwon, Soon Young Uiwang-si, KR 26 95
Park, Kyoung Soo Uiwang-si, KR 24 153
Park, Young Woo Uiwang-si, KR 106 700

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