Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device
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United States of America Patent
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Nov 15, 2016
Grant Date -
Jun 12, 2014
app pub date -
Feb 18, 2014
filing date -
Jan 16, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
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