Forming die assembly for microcomponents

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9492867
APP PUB NO 20120107434A1
SERIAL NO

13279759

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Abstract

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A forming die assembly for microcomponents includes a forming die and a punch. The forming die is formed with a cavity, a punch hole connected to the cavity, and a supply path for supplying a raw material with a metal powder and a binder having plasticity. The supply path is connected to the cavity so as to have a gate therebetween and is used for supplying the raw material into the cavity. The punch is slidably inserted into the punch hole, and it opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 ?1057325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishijima, Zenzo Matsudo, JP 22 109
Maekawa, Kazunori Matsudo, JP 7 42
Murasugi, Narutoshi Matsudo, JP 4 18

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