Multiphase resins with reduced percolation threshold

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United States of America Patent

PATENT NO 9493696
SERIAL NO

14951252

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Abstract

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In some embodiments, a resin has a first domain having a first polymer. The resin has a second domain within the first domain having a second polymer and coupled to the first domain at a plurality of interfaces. The resin also has a thermally conductive filler material distributed along the plurality of interfaces. The thermally conductive filler material is present at a concentration between about 0.1 vol % and about 15 vol % of the resin.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boday, Dylan J Austin, US 268 1386
Garcia, Jeannette M San Leandro, US 123 382
Hedrick, James L Pleasanton, US 294 1238
Wojtecki, Rudy J San Jose, US 156 703

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