Copper electrodeposition in microelectronics

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United States of America Patent

PATENT NO 9493884
APP PUB NO 20140102909A1
SERIAL NO

14108954

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Abstract

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A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a quaternized pyridinium salt compound for leveling.

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CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Figura, Paul Orange, US 10 136
Hurtubise, Richard Clinton, US 35 310
Lin, Xuan Watervliet, US 36 416
Paneccasio,, Jr Vincent Madison, US 25 150

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